发明名称 HEAT-BONDABLE FILM
摘要 PURPOSE:To provide the titled film which is made porous after heat-bonding to form an air-permeable bonded layer, by molding a resin compsn. composed of an ethylene polymer resin and a tackifying resin into a film having a specified thickness. CONSTITUTION:1-20pts.wt. tackifying resin having a softening point of 60 140 deg.C such as a coumarone-indene resin is blended with 100pts.wt. ethylene polymer resin having a m.p. of 80-120 deg.C such as an ethylene-vinyl acetate resin. The resulting resin compsn. is extruded into a film having a thickness of 20-200mu by a T-die extrusion method, an inflation method, etc. EFFECT:This film has such a heat resistance that 180 deg. peel strength is 300g/inch width or higher even in an atmosphere of 80 deg.C. USE:Bonding of automotive trim materials, ceiling materials, furnishing materials, etc.
申请公布号 JPS5757769(A) 申请公布日期 1982.04.07
申请号 JP19800132991 申请日期 1980.09.26
申请人 MITSUI TOATSU KAGAKU KK 发明人 ENOSHITA YOSHISUKE;HOSONUMA MAKOTO;MAKIGUCHI HIROSHI;SUGIYAMA HISASHI
分类号 C09J7/02;B29D7/01;B29K23/00;C09J7/00;C09J123/02;C09J131/04 主分类号 C09J7/02
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