| 摘要 |
PURPOSE:To automate an appearance inspection by detecting optically a target pattern provided on the semiconductor wafer surface and having a one to one correlation relation against a primary factor foa bad appearance. CONSTITUTION:A target pattern having a one to one correlation relation as compared with line width of a pattern of elements and wiring is prepared on a wafer, and using the pattern, a photo resist treatment for the target pattern along with a prescribed pattern formation is performed. The wafer 1 is put on a sample table 13, and by utilizing laser beams oscillated from a laser oscillator 24, the pattern line width of the target pattern is measured through an analog signal processing part 26, an appearance inspecting and treating part 27 and a dimension measuring and processing part 28. And, the measured values are sent to a data processing part, and in case where the measured vaues indicate abnormality against prescribed values the appearance is judged to be bad. Hereby, skillfulness of workers is not required, and precise decision for the quality can be done. |
