| 摘要 |
<p>PURPOSE:To divide the subject wafer efficiently by a method wherein a cylindrical roller is supported by the guide rail provided on both sides of the rotatable plate on which the wafer is placed. CONSTITUTION:On the placing plate 6 of the wafer 4 which is directly connected to a motor 7 and has a hole 5 on the surface, the wafer 4 pasted on a resin sheet 3 is placed and vacuum-attracted. Then, a roller 1 is rolled toward this side of the guide rail, the first line direction of the wafer 4 is divided, the plate 6 is rotated by 90 deg. using the motor and the second line direction of the wafer 4 is divided by rolling the roller 1 toward the back side. According to this constitution, the rolling direction of the roller is maintained constant, the generation of defective products is prevented and the dividing work can be performed efficiently.</p> |
