PURINTOKAIROYOPURASUCHITSUKUYOKI

摘要

The present invention relates to integrated circuits. A housing according to the invention comprises a radiator plate (10) onto which is fixed an integrated circuit (1). This radiator plate has its second face (12) flush with the level of a main face of the housing and has a staged structure. It can consist of a stack of two thermally conducting platelets (14) and (15). Application to improving housings for integrated circuits.