| 摘要 |
PURPOSE:To consolidate adherence of a chip to an insulating substrate by a method wherein a metal layer forming eutectic with an electroconductive layer provided on the insulating substrate is provided on the back surface of a semiconductor substrate before dividing the semiconductor substrate into chips. CONSTITUTION:On the occasion when the chip 1 prepared by dividing the semiconductor substrate whereon a circuit element is formed is fused to the insulating substrate having a metallized Au layer 2 and is sealed by a cap 5, first Sn forming eutectic with Au is connected to the back surface of the semiconductor substrate and then the substrate is divided into the chips. By this method, the adherence is consolidated since the Au provided on the insulating substrate and the Sn on the back surface of the chip form the eutectic, and thereby the reliability of the device is increased. |
