Sublimation patterning process.

摘要

A method for patterning layers of material on a substrate without photoresist by using a selective sublimation process. A substrate (1) having a high thermal conductivity has a patterned layer (2) of a material having a low thermal conductivity deposited on its surface. A layer of high thermal conductivity patterning material (3, 5) is then deposited over the entire surface of the structure. A radiated energy source (4) is focused on the structure for sufficient time to allow the patterning material (3) above the low thermal conductivity material (2) to build up the internal heat level for sublimation. The patterning material (5) over the high thermal conductivity substrate (1) does not build up enough internal heat for sublimation and remains intact.