| 摘要 |
PURPOSE:To automate the mounting of a chip and to enable to automate assembling of a sandwich type IC by a method wherein subchips are put in a line discriminating the surface and back face thereof and are selected, one of them is separated and is sucked to be held, and is transported to the heated mounting part and is fixed pressure. CONSTITUTION:The subchips 21 to be used for assembling of sandwich type IC are formed in a cylindrical type being provided with a trail at one side end face, and are sent in a shutter mechanism 33 forming a line by a feeder 30, and are separated one by one. When an IC mounted with a pellet 22 is transported to the regular position of station together with a heating block 25 by a transporting parts 23 and stops, it is detected and an arm 37 operates, the separated chip 21 is transported to the mounting part by sucking needle 34, and is pressed to be fixed with pressure. By performing arrangement in a line, separation, sucking, transportation and adhesion with pressure of the chip 21 sequentially in order, mounting of chip can be automated, workability can be improved, and precision of positioning is enhanced to enable automatic bonding. |
