DENSHISOSHOKEESHINGUNOSEIZOHO

摘要

The process comprises starting from a metal strip 2; producing projections 6 by pressing or stamping, the projections 6 projecting from the upper face of the strip; forming an insulating layer 18 which adheres to the upper face of the strip and to the projections 6; removing a part of the metal strip beneath the insulating layer 18 without removing the projections 6 to define a cavity 20 by means of the insulating layer and a surrounding metal rim portion which is formed by cutting slots 8, 8' through the metal strip. The electronic component 20 is fixed in the cavity on the insulating layer 18 and the projections 6 serve as lead- out terminals for electrically connecting the component to the exterior of the casing. A cover to close the cavity is then formed and fitted.