| 摘要 |
PURPOSE:To obtain an LSI module having high equipping density by a method wherein slanting surfaces are formed at the circumference of a rectangular ceramic carrier being fixed with the LSI logic element, and plural carriers are constituted as the slanting faces of respective carriers to come in contact with each other. CONSTITUTION:The LSI elements 1 are fixed to four side faces of a base 32 of tower type fins 31 formed with a thermally good conductive material. After a means to form the LSI's in a module is performed, flat lead pins 23 led out from the side faces of the respective chip carriers 2 as to be of equal length with the base bottom face of the base 32 are put on the prescribed positions of a mother board 4. While the slanting end faces 25 having inclination of 45 degrees are formed at the circumference of the chip carrier 2 consisted of a rectangular insulating substrate, and pad patterns 25X are provided on the end faces 25 at an equal pitch. Therefore when the carriers 2 are made to come in contact with the four faces at the circumference of the base 32 of the heat radiating fins, the respective pad patterns 25X are adhered with pressure precisely with each other. |
