| 摘要 |
Thermal dissipation problems characteristic of micropackaging applications in integrated circuits can be eliminated by the use of a semiconductor heat pipe package. Additionally, the heat pipe package as herein disclosed can be employed for the creation of substantially constant temperature surfaces. In applications where a device requires controlled temperatures in order to achieve optimum operation, such as in photo voltaic converters, the packaging of the present invention provides a means for such temperature control. The heat pipe package comprises, in its simplest form, a closed vessel or box containing a heat transferring fluid. In its liquid state, the heat transferring fluid is transported along the interior surfaces of the box by means of a plurality of microgrooves through capillary action. The interior cavity of the heat pipe package or box provides a means for transport of the heat transferring fluid in the vapor state. The integrated circuits may be disposed in the semiconductor surface of the package itself, or mounted as dies in high density. The large number of intercommunications which are required between the high density of integrated circuits included with the micropackaging can be achieved by a combination of optical and electrical communication lines or buses.
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