| 摘要 |
<p>W.519 Moulded wafer products are prepared by a novel process in novel apparatus from dough of high sugar content (25-60% w/w based on the farinaceous dough ingredient) by a twostage process comprising initial baking of a light-textured wafer material (e.g. 2-3 mm thick), introducing the water while still hot (e.g. above 160-195.degree.C), into a cooling and compressing mould of the apparatus, and compressing the wafer to reduce its wall thickness, e.g. by about 15-50%.</p> |
