发明名称 LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the opening of a bonding and to prevent the damage of a resin sealing layer by forming a connecting hand of narrow width at the connecting part of the bridge of a lead frame and the outer frame and forming a hole at the outer frame. CONSTITUTION:A connecting hand 11a of narrow width is formed at the connecting part of the bridge 15 of a lead frame body 10 made of an outer frame 11, a partition frame 12, an islant 13 a lead 14 and a bridge 15 with the outer frame 11, and a hole 16 is formed at the outer frame 11. In this manner, the opening of the bonding due to the displacement of the position of the lead can be prevented, the tensile strength applied to a resin layer at the time of curing and contracting the resin layer at the time of curing and conracting the resin sealing layer is alleviated, thereby preventing the damage at the resin sealing layer.
申请公布号 JPS5752156(A) 申请公布日期 1982.03.27
申请号 JP19800128306 申请日期 1980.09.16
申请人 TOKYO SHIBAURA DENKI KK 发明人 KUDOU YOSHIMASA
分类号 H01L23/50;H01L21/56;H01L23/495 主分类号 H01L23/50
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