| 摘要 |
PURPOSE:To automate the etching treatment thoroughly of a semiconductor substrate by lifting a substrate in a container by upward and downward moving means provided under the container, lowering a gripper of a holding unit supported by a robot to grip the substrate, and etching the same in a treatment tank by the operation of the holding unit. CONSTITUTION:A container 27 containing a semiconductor substrate 1 completely pretreated is placed on a reception frame 22. Then, it is stopped on the container 27 in the state that the robot 11 is lowered and the gripper of a holding unit 28 is opened. Thereafter, upward and downward moving means 23 are operated to raise the support 26 in a direction C, receives the substrate 1 from below and lifts it to gripping grooves 32a. Then, the supporting unit 28 is operated to rotate the grippers 32 in the directions D, F to grip the substrate, to hold it in the treatment tank and to etch it. The treated substrate is contained in the container in the reverse sequence to the above operation. In this manner, the transfer of the substrate becomes unnecessary, thereby automating thoroughly the etching treatment. |
