| 摘要 |
PURPOSE:To prevent the exfoliation and the damage of a conductor by providing a solder connecting part at a position slightly separated from the IC chip mounting position of a conductor, placing a new chip placed with its front side back while placing a solder at the vacant position wherefrom defective chip has been removed and connecting a solder and the solder connecting part with the conductor. CONSTITUTION:A new chip 1a is placed at the back side on the front on a substrate 4 while the exfoliated part of a conductor 3 is produced as it is. Then, a solder 6 is placed on a positon of a new IC chip 1a to be originally placed with the solder. On the other hand, a solder connecting part 7 is provided on a position slightly isolated from the mounting position of the IC chip 1a of the conductor 3. Then, a new conductor 8 is connected between the solder 6 and the solder connecting part 7. When a defective IC chip is replaced in this manner, it can prevent the exfoliation and the damage of the conductor on the substrate. |
