| 摘要 |
PURPOSE:To prevent the damage of the corner of a pellet at the time of assembling and to reduce the number of steps by connecting a plurality of semiconductor pellets with coating member except both-side metal electrode, disposing it on a lead frame and soldering it. CONSTITUTION:After a plurality of semiconductor pellets 14 are disposed on a substrate, secondary coating material 15, e.g., silicone rubber, epoxy resin, polyimide resin, etc. is filled, thermally cured, thereby forming a coating carrier 16 (17 represents a recess groove for facilitating the cutting) exposed on the metallic electrode on both side surfaces of the pellet, a carrier 16 is interposed between the lead frames, the lead and the metallic electrode are soldered, and the prescribed circuit configuration is formed. In this manner, the step of providing the polarity of the pellet can be eliminated, thereby reducing the number of steps and preventing the damage of the corner or the like of the semiconductor pellet. |
