Package for PCB mounted integrated circuit - has chip and associated leads placed on thin MOS compatible layer on each side of which PCB substrate is provided

摘要

The casing contains at least one integrated circuit chip (11) connected by thin wires (12,13) to a printed circuit board (14). The casing is fitted with external terminals (15,16). The chip (11), with its connecting wires (12,13), is placed in an approximately 0.5 mm thick thin layer (17) made in a moulding material compatible with the MOS components. This layer is sandwiched between the PCB (14) and another PCB (17) which does not have any electrical circuit. Both PCB's have the same mechanical properties and are 0.2 mm thick. The use of the second PCB (17), permits a reduction of the thickness of the various layers and thus leads to a robust thin casing.