| 摘要 |
PURPOSE:To eliminate a defective soldered electrode without corroding an underlying metal, by a method wherein vapor including oxygen is guided in a glacial acetic acid or acetic acid solution and a soldered electrode including lead and tin to be removed is left in the solution. CONSTITUTION:An Si substrate 1 having solder is left in glacial acetic acid foamed oxygen to perform etching and a defective soldered electrode 9 is removed. After removing the solder, a soldered electrode is newly formed again. This method completely eliminates lead and tin layers only forming solder without damaging an underlying metal. |
