| 摘要 |
PURPOSE:To prevent misindication and to increase workability, by a method wherein a defect signal from a probe is received after judging quality by closely attaching the probe of a quality judging device to each of the semiconductor chips and quality indication is printed on defective chips. CONSTITUTION:The probe of a quality judging device is closely attached to each of a plurality of chips 10a formed on a semiconductor wafer 10 for an electrical characteristic test and the quality is jedged. Next, a dot printer 11 electrically connected to the probe of the quality judging device is used to print indication modes 12 for defective chips on defective chips 10a' in accordance with a detection signal for defective chips. This method prevents misindication to good chips and increase the workability. |
