发明名称 |
System for soldering a semiconductor laser to a metal base |
摘要 |
A GaAs diode and a copper base are joined together so as to form a soldered system comprising an indium layer inserted between two tungsten layers which serve as a barrier for preventing indium diffusion. A thin gold or platinum wetting layer is applied to the tungsten layers to aid in adherence of the solder to the tungsten without the impairment of the indium during soldering operations due to alloying. The invention is applicable to optical-fiber telecommunication systems.
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申请公布号 |
US4321617(A) |
申请公布日期 |
1982.03.23 |
申请号 |
US19790058925 |
申请日期 |
1979.07.19 |
申请人 |
THOMSON-CSF |
发明人 |
DUDA, EUGENE;MAUMY, ALAIN;TONDU, CLAUDE |
分类号 |
H01L33/00;B23K35/00;B23K35/20;H01L21/52;H01L21/60;H01S5/00;H01S5/02;H01S5/022;(IPC1-7):H01L21/60 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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