发明名称 |
Nickel plating method |
摘要 |
A simple method for plating nickel onto silicon which renders unnecessary any catalyzing pretreatment of the silicon surface which is to receive the nickel. The method comprises the immersion of a silicon substrate in a suitable nickel bath in order that nickel ions in the bath will be reduced to solid nickel and deposited onto the substrate so as to form an adhering layer thereon. The method is especially advantageous in plating nickel onto silicon shallow junction devices for the purpose of providing ohmic contacts.
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申请公布号 |
US4321283(A) |
申请公布日期 |
1982.03.23 |
申请号 |
US19790088396 |
申请日期 |
1979.10.26 |
申请人 |
MOBIL TYCO SOLAR ENERGY CORPORATION |
发明人 |
PATEL, KIRIT B.;GONSIORAWSKI, RONALD |
分类号 |
H01L21/288;H01L31/0224;(IPC1-7):H01L21/28;C23C3/00 |
主分类号 |
H01L21/288 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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