| 摘要 |
<p>A process for fusion-bonding of resins, which comprises applying a layer of thermoplastic resin having a light transmittance lower than 20 % and a melting point of 40 to 256.degree.C. to a substrate and fusion-bonding the resin layer to the substrate by emission energy of a flash discharge lamp. The electric input energy J (joule) of the flash discharge lamp is controlled relative to the weight of the resin layer.</p> |
