发明名称 |
Photosensitive compositions containing polyamides acid with photosensitive groups |
摘要 |
There is described photosensitive polymer composition and a polyimide film-coated material made by applying the composition to a support, irradiating with ultraviolet and thereafter heating. The photosensitive polymer composition is prepared by adding a sensitizer to a photosensitive polyamide acid intermediate solution which is obtained by reacting in an inert solvent a first compound comprising 100 to 5% by weight of a photosensitive group-containing diamine and 0 to 95% by weight of a diamine having no photosensitive group, with a second compound comprising at least one compound selected from a tetracarboxylic acid dianhydride and a tricarboxylic acid anhydride monohalide.
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申请公布号 |
US4321319(A) |
申请公布日期 |
1982.03.23 |
申请号 |
US19800198952 |
申请日期 |
1980.05.22 |
申请人 |
HITACHI, LTD. |
发明人 |
SHOJI, FUSAJI;TAKEMOTO, ISSEI;YOKONO, HITOSHI;ISOGAI, TOKIO |
分类号 |
C08G73/10;C08G73/12;C08G73/14;G03F7/038;(IPC1-7):G03C1/68 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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