发明名称 Photosensitive compositions containing polyamides acid with photosensitive groups
摘要 There is described photosensitive polymer composition and a polyimide film-coated material made by applying the composition to a support, irradiating with ultraviolet and thereafter heating. The photosensitive polymer composition is prepared by adding a sensitizer to a photosensitive polyamide acid intermediate solution which is obtained by reacting in an inert solvent a first compound comprising 100 to 5% by weight of a photosensitive group-containing diamine and 0 to 95% by weight of a diamine having no photosensitive group, with a second compound comprising at least one compound selected from a tetracarboxylic acid dianhydride and a tricarboxylic acid anhydride monohalide.
申请公布号 US4321319(A) 申请公布日期 1982.03.23
申请号 US19800198952 申请日期 1980.05.22
申请人 HITACHI, LTD. 发明人 SHOJI, FUSAJI;TAKEMOTO, ISSEI;YOKONO, HITOSHI;ISOGAI, TOKIO
分类号 C08G73/10;C08G73/12;C08G73/14;G03F7/038;(IPC1-7):G03C1/68 主分类号 C08G73/10
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