发明名称 HEAT TREATMENT OF SEMICONDUCTOR
摘要 PURPOSE:To eliminate the occurrence of a crystalline defect of a semiconductor by sealing in vacuum an element having the same vapor pressure as component elements of compound semiconductor material to be treated having high vapor pressure and always disposing the element in the high moisture part higher than the material, thereby suppressing the dissociation of the component elements from the surface of the material. CONSTITUTION:A quartz ampule 4a is inserted into a quartz tube forming a diffusion furnace with one end C side disposed at the interior and with the other end D side disposed at the beforehand. when GaAs 5 to be treated and an impurity source Zn 6 to be diffused are sealed in vacuum in the ampule 4a, GaAs 5 and Zn 6 are additionally added further to the one end C disposed at the interior of the quartz tube and at one end D of the open end of the quartz tube, and As 7 is disposed at the interior of the GaAs 5. When the ampule 4a is inserted into the quartz tube in this manner, the As 7 us heated to the temperature higher than the temperature GaAs 5 rapidly, the As 7 is thus evaporated before the As is dissociated and evaporated from the GaAs 5, thereby suppressing the dissociation of the As from the GaAs 5.
申请公布号 JPS5749228(A) 申请公布日期 1982.03.23
申请号 JP19800125712 申请日期 1980.09.08
申请人 MITSUBISHI DENKI KK 发明人 NISHITANI KAZUO;NAGAHAMA KOUKI;ISHII JIYUN
分类号 H01L21/22;H01L21/223 主分类号 H01L21/22
代理机构 代理人
主权项
地址