| 摘要 |
PURPOSE:To eliminate nonuniform plating due to overlap of metal caps in the plating process and facilitate the automatic feed by means of an automatic loader, by providing small projections to a metal cap. CONSTITUTION:A square metal cap 11 to be seam-welded is provided with samll projections 18 near the four corners of a drawn part 17 to be a positioning part with respect to a ceramic package, when a thin metal plate is drawn, the projections 18 being smaller in height than the depth of the drawn part 17. Said small projections 18 so functions that when metal caps 11 overlap with each other, a gap is provided therebetween. Said metal cap 11 is seam-welded to a metal frame part 2 of a ceramic package 3. Thereby, it is possible to stabilize the automatic assembly in seam welding operation and improve a seam-weld seal type semiconductor device in quality. |
