| 摘要 |
Socket (10) for housing similar integrated circuits (1, 2). The socket (10) comprises a center support (14) which includes integral an d panels (14a, 14b). The center support further includes a plurality of upstanding separators (42, 44) which form a plurality of recesses (46, 48). Side panels (18, 20) are joined to the center support to form first and second chambers (23, 24). A bottom plate (16) is connected to the center support (14) and side panels (18, 20). A lead frame (22) is positioned within the first and second chambers to provide metallic strips within the recesses (46, 48). In certain of the recesses the metallic strips extend from corresponding recesses in the two chambers (23, 24) and connect to a respective socket lead (12). In other selected recesses a metallic strip extends directly to connect to a package lead (12) such that there is no direct connection between common recesses. The integrated circuits (1, 2) are positioned within the chambers (23, 24) such that the leads of the integrated circuits (1, 2) are received within the recesses (46, 48). Certain leads of the devices (1, 2) are connected in common to a socket lead (12) while other leads of the devices (1, 2) are connected independently to socket leads (12) such that the two devices (1, 2) can be operated independently. |
