| 摘要 |
A semiconductor integrated circuit is manufactured by forming a plurality of circuit elements in a semiconductor substrate, covering the circuit elements with an insulating film except exposed portions thereof, forming a first conductive path on the insulating film, at least a portion of the first conductive path overlaying predetermined portions of the circuit elements and electrically connected therewith, applying a second insulating film on the first conductive path, forming a second conductive path to overlay the first conductive path and applying a breakdown voltage across the first and second conductive paths to breakdown the second insulating film interposed therebetween via a circuit element, thus electrically interconnecting the first and second conductive paths.
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