发明名称 THERMAL PRINTING DEVICE
摘要 PURPOSE:To provide a thermal printing device excellent in heat response property and capable of printing at higher speeds by a method wherein resistance elements are placed on the surface of a substrate consisting of a good thermal conductor through a very thin layer of an electrically and thermally non-conductive material. CONSTITUTION:The good thermal conductor 11 is used as the substrate, and the layer 12 of the thermally non-conductive material of a thickness of 15-90mu is formed on a selected surface of the substrate. Then, the resistance elements 13, electrical conductors 14 for connecting the elements 13 and an insulating protective film 15 covering both of them are selectively provided on the layer 12. The thermally non-conductive material constituting the layer 12 is also an electrically non- conductive material, and the heat present in the resistance elements 13 after recording on a heat-sensitive recording material can be dispersed to the part beneath the elements 13 in a short period of time.
申请公布号 JPS5746895(A) 申请公布日期 1982.03.17
申请号 JP19810099583 申请日期 1981.06.29
申请人 OKI DENKI KOGYO KK;NIPPON DENSHIN DENWA KOSHA 发明人 IKEGAME MAMORU;SATOU YOUICHI;KANISAWA HAJIME;OOTA SATORU;MATSUNAGA KOUJI
分类号 B41J2/335;B41J2/34;B41J2/345 主分类号 B41J2/335
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