| 摘要 |
<p>TWO-SIDED PLANAR MAGNETRON SPUTTERING APPARATUS Apparatus for depositing layers of materials onto substrates by magnetically enhanced cathodic sputtering; typically comprising an enclosure having atmospheric sealing means between the atmosphere inside and the atmosphere outside the enclosure, vacuum pump means connected to the enclosure to reduce the pressure inside relative to the atmospheric pressure outside the enclosure, a cathode within the enclosure comprising a substantially planar frame formed about a parallel interior plane, a plurality of magnets supported within the frame and positioned with the neutral axis of each magnet substantially in the interior plane, and at least one target plate supported on the frame on opposite sides of the interior plane, insulation means between the frame and the enclosure, means for connecting an electrical potential difference between the frame and the enclosure, and means in and supported by the enclosure for supporting and conveying the substrates on opposite sides of, and parallel to, the target plates from a position on one side edge to a position on the opposite side edge of the cathode.</p> |
