| 摘要 |
<p>The invention relates to a semiconductor component (10) which has a semiconductor body (38) soldered onto a base (12), and supply leads (14, 18, 20) which extend away from a zone of a base (12) edge having a groove (28), one of which supply leads (18) projecting into the groove (28) and being soldered to the base (12). The component is to be designed in such a way that it can be fabricated in a reliable manner employing the wire-bonding technique. This is achieved by means of at least one channel (34) which runs in the base (12) in the direction from the groove (28) towards the base edge opposite thereto, and by solder which extends below the semiconductor body (38) along the channel (34) towards the groove (28) for soldering the one supply lead (18) to the base (12). <IMAGE></p> |
