| 摘要 |
PURPOSE:To improve the safety of a device for cleaning the surface of a semiconductor wafer by composing the devide of a dehydration baking treating means and chemically dehydrating means, integrating them, and employing a microwave generator as heating means for the baking means, thereby eliminating silane coupling gas inflammation and the like. CONSTITUTION:A semiconductor wafer surface cleaning device is composed of a loader 3 for supplying wafers 1 one by one from a cartridge 2, and a conveyor 4 for conveying the supplied wafer 1 to respective treating sections. Further, the device is composed of a cleaning section 5 for forcibly cleaning the wafer 1 thus conveyed in contact with the conveyor by brush cleaning and rotatably drying it, and a dehydration baking section 6 for dehydrating the water content on the surface of the wafer 1 by microwave induction heating in a short time. Moreover, the device has a chemically dehydrating section 7 for chemically removing the OH group of the surface of the wafer 1, and an unloader 9 for setting a cartridge 8 and containing the wafers 1 one by one after treating the wafers 1, and all these sections are controlled by a controller 10. |
