发明名称 CIRCUIT SUBSTRATE AND MANUFACTURE THEREOF
摘要 PURPOSE:To facilitate the connection of a wire by selectively forming an Al2O3 on the surface of an aluminum substrate to form a recess, containing a semiconductor part in the recess and forming a conductor wire on the Al2O3. CONSTITUTION:A mask 32 is formed on an aluminum substrate, is then anodized, an Al2O3 33 is formed, the mask 32 is then removed, the Al2O3 is etched with NaOH solution, and a recess 34 is formed. An Al2O3 36 is again formed on the inner wall of the recess as required. In this manner, a semiconductor part 31 is contained in the recess 22 formed on the aluminum substrate 21, is adhered at 32, and is connected at the connecting points 33a, 33b to conductor wires 24 respectively. Since the wires 24 on the surface of the substrate 21 and the upper surface of the part 31 become approximately flat with this configuration, the wire connecting work can be facilitated, and since only the wires are decreased in deflection, no wire contact accident occurs.
申请公布号 JPS5745957(A) 申请公布日期 1982.03.16
申请号 JP19800121907 申请日期 1980.09.02
申请人 MATSUSHITA DENKI SANGYO KK 发明人 KITAHIRO ISAMU
分类号 H01L23/14 主分类号 H01L23/14
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