| 摘要 |
<p>PURPOSE:To remove a nichrome oxide depositing on a gold evaporated film without damaging a resistor element by partially coating the resistor element by using a photo-resist before rubbing the surface of a substrate by means of a writing brush or a brush. CONSTITUTION:In the manufacture of a tantalum thin-film circuit which forms a circuit consisting of a conductor and the resistor 2 on the heatproof insulating substrate 3 composed of porcelain by employing the metallic thin-fims of tantalum 4, nichrome 5, gold 6, etc. and shapes a solder layer 7 to the conductor section through solder immersion treatment, the resist protective film 8 is formed on a resistor film before solder immersion treatment, and the resistor is protected mechanically. The surface of the substrate (the surface of the gold evaporated layer 6) is rubbed by means of the writing brush or the brush to remove the nichrome oxide, the resist film is removed by a parting agent and the whole is immersed in a solder tank, thus forming the solder layer 7 on the gold evaporated layer 6 of the conductor section.</p> |
