发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain a superior printing plate or the like having superior flexibility and impact resistance and causing no chipping even at low temp. and humidity by adding a polymerizing unsatd. compound and a photoreaction initiator to a polyvinyl alcohol (PVA) polymer and water soluble polyamide in a specified ratio. CONSTITUTION:To 100pts.wt. PVA polymer preferably having >=50mol% saponification degree and >=50 polymn. degree are added 0.5-100pts.wt. water-soluble polyamide preferably contg. 1-50mol% sulfonic acid or sulfonate in each molecule, an unsatd. compound having a polymerizing double bond such as bisacrylamide by 5-100wt% to the total amount of said polymers and a photopolymn. initiator such as benzophenone. The resulting composition is formed into a sheet and adhered to a support, or it is applied to a support and dried to obtain a photosensitive resin plate. Using the plate a printing plate for letterpress printing, etc. with superior flexibility, impact resistance, etc. is obtd.
申请公布号 JPS5745535(A) 申请公布日期 1982.03.15
申请号 JP19800122030 申请日期 1980.09.02
申请人 UNITIKA KK 发明人 OKAMOTO TAKASHI;MITSUI MINORU
分类号 C08F2/00;C08F2/50;C08F291/00;C08F291/12;C08L29/00;C08L29/04;C08L77/00;G03F7/032;G03F7/033;G03F7/037 主分类号 C08F2/00
代理机构 代理人
主权项
地址