METHOD OF BONDING PREPARATORY MOLDING SOLDER RING TO COVER FOR VESSEL

摘要

A method is described for attaching a preformed solder ring to a cover used to hermetically seal a container for a semiconductor device. The surface of the preformed solder ring that engages the cover is caused to melt and bond to the cover on solidification while the opposite surface of the ring is maintained relatively cool in a solid state by abutment against the flat surface of a cooling block.