发明名称 MANUFACTURE OF HYBRID INTEGRATED CIRCUIT
摘要 PURPOSE:To prevent the exfoliation of a wiring lead frame from a substrate by securing in advance the lead frame to an external terminal lead frame and connecting the wiring lead frame to the substrate, thereby preventing the external force from being applied directly to the substrate. CONSTITUTION:A wiring lead frame 13 is secured in advance to an external terminal lead frame 11. Then, the lead frame 13 is connected to a substrate 3, and electric wiring is performed. Since external force is not applied directly to the substrate 3 in this manner, the lead frames 11, 13 are not exfoliated from the substrate 3.
申请公布号 JPS5743449(A) 申请公布日期 1982.03.11
申请号 JP19800119964 申请日期 1980.08.28
申请人 MITSUBISHI DENKI KK 发明人 KOBAYASHI EIJI
分类号 H01L23/50;H01L23/495;H05K3/34 主分类号 H01L23/50
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