| 摘要 |
PURPOSE:To absorb stress due to heat expansion and to effectively dissipate heat in a mounting structure for an integrated circuit substrate by connecting the electrode of a package substrate to the electrode of an intergrated circuit substrate by an elastic rod-shaped conductor passed fixedly through a heat dissipating hollow body. CONSTITUTION:A heat dissipating hollow body 6 formed with a cavity capable of flowing coolant therein is provided, and the electrode 2 of a package substrate 1 is connected with solder 5 to the corresponding electrode 4 of an integrated circuit substrate 3 by an elastic rod-shaped conductor 7 passed fixedly and insulated through the body 6. The body 6 is formed of good thermally conductive metal or the like material, and the insulating material is also formed of good thermally conductive material. Even if a lateral stress therefore occurs at the electrode 4 due to the differaences of the temperature and heat expansion coefficient between the substrates 3 and 1, it can be absorbed to the leasticity of the conductor 7. |
