| 发明名称 |
NIEDERDRUCK-PRESSMASSE ZUM UMHUELLEN VON ELEKTRONIS CHEN BAUELEMENTEN |
| 摘要 |
<p>Low-pressure moulding cpd. for encapsulating electronic components by transfer moulding comprises an epoxy resin derived from post-purified bisphenol-A and has Cl-content of is not >0.1 wt. %, pref. 0.05%. Low Cl-content prevents damage by electrolytic corrosion, esp. in presence of humidity and heat.</p> |
| 申请公布号 |
DE1789053(B1) |
申请公布日期 |
1972.04.27 |
| 申请号 |
DE19681789053 |
申请日期 |
1968.09.28 |
| 申请人 |
SIEMENS AG |
发明人 |
LINDNER HEINZ-JOACHIM DR RER N |
| 分类号 |
H01B3/40;H01G2/12;H01L23/29;H01L23/31;(IPC1-7):01L1/04 |
主分类号 |
H01B3/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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