| 摘要 |
An assembly is disclosed for mounting and for connectorizing an electronic switching device containing a heat generating semiconductor to an associated heat sink, wherein the switching device includes a body portion containing the semiconductor, a plurality of leads protruding from the body portion and a metallic heat conductive mounting tab carried by the body portion and protruding in a direction opposite to the leads. The assembly comprises a housing of dielectric material. The housing has a body cavity for receiving the body portion of the switching device and for preventing lateral movement thereof relative to the housing. The depth of the body cavity is slightly greater than the thickness of the body portion of the switching device to receive the complete body portion therein. The housing has a tab cavity for receiving the mounting tab of the switching device, and bias means formed integrally with the tab cavity for biasing the mounting tab outwardly from the housing. Upon securing the housing to the heat sink with the switching device therein, the mounting tab will be biased into intimate heat transmitting contact with the heat sink. The housing has a lead cavity contiguous to the body cavity for receiving the leads protruding from the switching device, the lead cavity being recessed to a depth such that the leads will be spaced from the heat sink when the assembly is affixed thereto. A plurality of electrical contacts are carried by the housing and fixedly secured to the leads extending from the switching device, whereby the contacts provide for an electrical connection between the switching device and an associated electrically conductive member and also serve to mechanically lock the switching device in the housing. |
