发明名称 |
Plastics housing for integrated circuits. |
摘要 |
The present invention relates to integrated circuits. A housing according to the invention comprises a radiator plate (10) onto which is fixed an integrated circuit (1). This radiator plate has its second face (12) flush with the level of a main face of the housing and has a staged structure. It can consist of a stack of two thermally conducting platelets (14) and (15). Application to improving housings for integrated circuits. <IMAGE> |
申请公布号 |
EP0047195(A2) |
申请公布日期 |
1982.03.10 |
申请号 |
EP19810401204 |
申请日期 |
1981.07.28 |
申请人 |
SOCIETE POUR L'ETUDE ET LA FABRICATION DE CIRCUITS INTEGRES SPECIAUX - E.F.C.I.S. |
发明人 |
VRAHIDES, MICHEL |
分类号 |
H01L23/34;H01L23/28;H01L23/31;H01L23/433;H01L23/495 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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