| 摘要 |
<p>1. Method of producing a carrier of electronic components (1), wherein a substrate (4) and a sheet of copper (3) are assembled by means of an adhesive layer (6) and wherein electrical contacts (7) for mounting said components (1) and each having a cantilever sections of sufficient length to permit an adaptation of the mechanic and thermal characteristics of the carrier and of the components (1) are formed by engraving of the copper sheet (3), the method being characterized in that, prior to the assembly operations, the adhesive layer (6) is formed in discontinuous manner in order to present voids (17) corresponding to the locations of implantation of certain components (1), said voids (17) having dimensions exceeding those of said components (1) and being marked by marking means permitting to obtain said cantilever sections arranged above said voids directly by engraving of the copper layer (3).</p> |
