发明名称 Low alloy lead frame
摘要 Lead frame of sufficient mechanical strength, lowered cost, excellent plating affinity and enhanced anticorrosion is obtained through increased contents of P and Cu and remarkably reduced content of Ni or Cr even without employment of the preparative Ni strike plating necessitated in the prior art.
申请公布号 US4318740(A) 申请公布日期 1982.03.09
申请号 US19800116644 申请日期 1980.01.29
申请人 NIPPON GAKKI SEIZO KABUSHIKI KAISHA 发明人 KOYAMA, TOMOYUKI,
分类号 H01L23/48;C22C38/00;C22C38/20;H01L23/50;(IPC1-7):C22C38/02;C22C38/04;C22C38/08 主分类号 H01L23/48
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