| 摘要 |
PURPOSE:To readily obtain the pattern of the circuit substrate by providing dry films which are adhesively layered in an element mounting hole in the resin substrate, and performing etching with the back surface of a copper foil in the hole being protected. CONSTITUTION:A bonding agent 2 is applied on a base film 1, and the element mounting hole 3 and a hole 4 are punched. The copper foil 5 is layered, and a dry film 6 is closely adhered to the upper and bottom surfaces. It is especially important to contact it intimately to the inside of the hole 3. It is effective, if the device is put into the gap between a hot roll 10 and a hot roll 11 having teeth 11a. When a mask 8 with a window 8a is applied, the back side 5a of a finger forming part of the copper foil is perfectly protected from etching liquid. When the resist mask is removed after the etching, the patterning of the fingers is completed. In this constitution, complicated conventional processes can be abolished, and the pattern of the circuit substrate can be formed in the simple way. |
