| 摘要 |
PURPOSE:To obtain a resin sealing body having light transmitting window which is characterized by excellent productivity, by bonding one end of a light transmitting member to the surface of the semiconductor by using a light transmitting bonding agent, and exposing other surface to the outside. CONSTITUTION:A pellet 4 is mounted on a tab 2'' of a lead frame, and connected to leads 2' with gold wires 7. Ultraviolet rays transmitting glass 14 is bonded to the surface of the pellet 4 with the bonding agent 15 having excellent ultraviolet rays transmittance. Then, a tape 16 for lift off is applied on the glass 14. The device is sealed by epoxy resin 17. The tape is removed, and an ultraviolet ray erasing type PROM with a light transmitting window is obtained. In this constitution, conventional high temperature heating treatment is not required, and workability is enhanced. Inexpensive UV glass is good enough as a light transmitting material. The window is bonded to only the necessary part, and the intrusion of various light beams which erase memory can be reduced. |
