| 摘要 |
PURPOSE:To facilitate the removal of the parts where the formation of an insulation characteristic thin film is not desired by using a high polymer mask of an org. compound having hydroxyl groups and making the film thickness of the mask considerably larger than that in the prior art. CONSTITUTION:This relates to a method of removing the parts where the formation of an insulation characteristic type thin film is not desired in a substrate for liquid crystal cells wherein at least one layer of said insulation characteristic thin film is formed on the surface of the substrate having a transparent conductive film in part thereof and on part on said conductive film. A mask is beforehand formed to a thick film of 10-100mum with an org. high polymer compound having hydroxyl goups of epoxy type and methacrylic type by a screen printing method, after which the insulation characteristic thin film is formed over the entire surface of the glass substrate. Since the insulation characteristic thin film sticks thinly on the mask and is in the state vulnerable to breakage, the insulation characteristic thin film on the mask is broken by the thermal decomposition stress of the mask at the time of calcining said film. The mask is stripped off by an aqeuous son. of hydrochloric acid type salts. |
