| 摘要 |
PURPOSE:To make it possible to remove a large quantity of heat from semiconductor elements, by providing a heat radiating device, which is mounted at a position corresponding to a main heat yielding chip on the rear surface of a chip carrier and has a high-density heat conducting area, and immersing the chip carrier in freezing mixture. CONSTITUTION:When semiconductor elements on a chip carrier 7, which is immersed in freezing mixture 3, are operated, a large quantity of heat is yielded in a main heat yielding chip 8a. The heat is transferred to a heat radiating device 11 from the carrier 7. The heat radiating device 11 has a high density heat conducting area, which can radiates a large quantity of heat to free air and has a structure that can readily discharge bubbles. Therefore, a large quantity of heat from the heat yielding chip 8a is discharged into the freezing mixture, and the chip 8a is sufficiently cooled. Since the amount of heating from the chips other than the heat yielding chip 8a is small, the chips 8a is sufficiently cooled by the heat radiation from the heat radiating device 11. The evaporated gas from the freezing mixture caused by the heat radiation from the heat radiating device 11 climbs and cools a conduit pipe 19, through which a conductor wire 18 is provided. The gas is guided to an exhaust pipe 14 and discharged to free air through a check valve 15. |
