| 摘要 |
PURPOSE:To easily and promptly measure the characteristics of a chip under the state of a semiconductor substrate before being formed into an element in a semiconductor element working at low temperatures. CONSTITUTION:A device consists of a sampling stand 17 for fixing a semiconductor substrate 16 which is a measured sample, a dampproofing chamber 14 having probes 15 therein for providing the measured sample 16 with evaluation terminals a refrigerant reservoir 18 for cooling the sample, a vacuum chuck 19 for fixing the sample 16, a guide inlet 20 supplying gas in the chamber 14 for dampproof, a valve 21, probe positioning jigs 22, 23 for moving the probes 15 to desired positions, a window plate 24 for light incidence, an exhaust port 25 for gas in the chamber. In measuring the sample, the probe positioning jigs 22, 23 are engaged with eath other so that the tips of the probes 15 may contact with the electroplate pad of the measured chip. Next, the semiconductor substrate 16 is cooled to measure the characteristics of the chip. |
