| 摘要 |
<p>PURPOSE:To improve humidity resistance and electrical characteristics at high temperatures, by sealing a semiconductor device with hardening composition which consists of novolak type epoxy resin, novolak type phenol resin hardener, and hardening accelerator such as organic arsine composites. CONSTITUTION:A hardener of epoxy resin composition includes the following: (a) novolak type epoxy resin of epoxy equivalent of 170-300, (b) novolak type phenol resin hardener, (c) at least one hardening accelerator selected from among triallyl, arsine, triallyl stibine and triallyl bismuthine, and if necessary, (d) epoxy resin composite hardener which includes at least one of inorganic fillers with a main ingredient of quartz glass or crystalline silica. Its ratio between phenol hydroxide radicals of said novolak type phenol resin and epoxy radicals of said novolak type epoxy resin falls between 0.5 and 1.5. A semiconductor device is sealed therewith.</p> |
