发明名称 HEATING EQUIPMENT FOR WAFER
摘要 PURPOSE:To unify surface temperature of a heating equipment, by a method wherein its heat-transmission layer is provided of two kinds of material boards which have different thermal conductivity each other and which are laminated alternately. CONSTITUTION:The heat-transmission layer HT, which has multilayer composition of alternately laminated two kinds of material boards which have substantially different thermal conductivity each other, for example, highly conductive aluminum and less conductive alumina, is provided on a heat source layer HS in which linear heater blocks HB are embedded. A heating plate HP on which wafers are placed is provided on the heat-transmission layer HT. With above configuration, the heat- transmission layer has higher thermal conductivity in the direction of the layer plain compared to that in the direction of the heat-transmission and when the heat is transferred from the layer with high conductivity to that with low conductivity the temperature distribution is gradually made uniform and the uniform temperature distribution is provided on the heating plate HP so that the quality of the films like resist film becomes uniform and the yield rate is improved.
申请公布号 JPS5739528(A) 申请公布日期 1982.03.04
申请号 JP19800115071 申请日期 1980.08.21
申请人 TOKYO SHIBAURA DENKI KK 发明人 KAWATE KEIICHI
分类号 H01L21/52;H01L21/18;H01L21/205 主分类号 H01L21/52
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