| 摘要 |
PURPOSE:To rigidly bond the bonding wire of a semiconductor device without using gold by pressing and holding the wire with a hook formed at an inner lead. CONSTITUTION:When a semiconductor element 12 is mounted on the island 11 of a lead frame and a bonding pad 13 formed on the element 12 and an inner lead 14 are connected with a bonding wire 16, the wire 16 is pressed and held by a hook 15 provided at the lead 14. Since the wire can be mechanically rigidly bonded in this manner, gold plating or the like is not necessary. |
