| 摘要 |
<p>The top and bottom parts of a hollow article, one of which is coated with thermoplastic and/or thermosetting adhesive, are bonded together by aligning them together and heating to the setting temp. of the adhesive. The two aligned parts are placed inside a pressure-tight container and this is brought up to the required temp. Reliable method overcomes problems of maintaining appropriate temp./time curve which varies with the age of the adhesive; suitable process for bonding covers on to microswitch units/hybrid circuit units using adhesive-coated covers.</p> |
